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четверг, 8 февраля 2018 г.

Samsung приступил к массовому производству чипов памяти eUFC 2.1 для автомобилей




В сегодняшнем официальном пресс-релизе корпорация Samsung Electronics сообщила о запуске в серию встраиваемых модулей флэш-памяти объёмом 256Гб, предназначенных для автомобильной индустрии. модули соответствуют требованиям спецификации eUFS (embedded Universal Flash Storage) 2.1.
Южнокорейский вендор отмечает, что этот продукт стал первым в отрасли, обеспечивающем возможности, стандартизованные в UFS 3.0.
С учётом области применения модули рассчитаны на работу в диапазоне температур от -40°С до +105°С. Наличие встроенного датчика температуры позволяет уведомлять процессор о превышении допустимого предела. Эти данные процессор может использовать для снижения тактовой частоты с целью понижения температуры до приемлемого уровня.
Скорость последовательного чтения достигает 850МБ/с, а максимальная производительность на операциях чтения с произвольным доступом заявлена равной 45.000 IOPS.

Samsung Begins Mass Production of 256GB Embedded Universal Flash Storage for Automotive Applications

The new 256GB eUFS 2.1 for automotives is the industry’s first storage device to incorporate advanced features of the UFS 3.0 standard for automotive applications. 
Enhanced warranty for extended temperature range offers optimum solution for next-generation automotive systems.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.
Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.
As thermal management is crucial for automotive memory applications, Samsung’s 256GB eUFS extends the temperature range to between -40°C and +105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to +85°C for vehicles in operation and -40°C to +85°C when in idle or power-saving mode,
“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”
Samsung’s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.
Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.
The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.
Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.

вторник, 26 сентября 2017 г.

Samsung запускает производство первых в отрасли флэш-чипов eUFS для автомобильных систем





Корпорация Samsung Electronics сегодня анонсировала первые в отрасли встраиваемые чипы флэш-памяти Universal Flash Storage (eUFS), предназначенные для автомобильного бортового оборудования.
UFS — это общая спецификация флэш-накопителей для различных электронных устройств. По сравнению с широко используемой памятью eMMC, чипы UFS обеспечивают существенное увеличение производительности при одновременном снижении потребляемой энергии.
Новые чипы Samsung eUFS рассчитаны на использование в составе передовых систем помощи водителю (Advanced Driver Assistance Systems, ADAS), приборных панелей следующего поколения, а также информационно-развлекательных комплексов.
Представлены изделия вместимостью 64 и 128 Гбайт. Они выполнены в соответствии со стандартом JEDEC UFS 2.1. Заявленная скорость чтения данных достигает 850 Мбайт/с, что приблизительно в 3,4 раза выше по сравнению с показателями памяти eMMC 5.0. Количество операций ввода/вывода в секунду (показатель IOPS) при чтении достигает 45.000 — это примерно в 6,3 раза больше, чем у eMMC.
Контроллер чипов Samsung eUFS содержит датчик температуры, что позволяет отслеживать состояние микросхем и контролировать приближение температуры к критическим значениям.
В Samsung заявляют о начале производства новых изделий eUFS. Таким образом, в скором времени такие чипы появятся в подключённых автомобилях и прочих транспортных средствах с системами автопилотирования.

Samsung Starts Producing Industry’s First Universal Flash Storage For Next-Generation Automotive Applications

Samsung Electronics, the world leader in advanced memory technology, today announced that it is introducing the industry’s first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Consisting of 128-gigabyte (GB) and 64GB versions, the new eUFS solution has been designed for advanced driver-assistance systems (ADAS), next-generation dashboards and infotainment systems that provide comprehensive connected features for drivers and passengers worldwide.
“We are taking a major step in accelerating the introduction of next-generation ADAS and automotive infotainment systems by offering the industry’s first eUFS solution for the market much earlier than expected,” said Jinman Han, Senior Vice President of Memory Product Planning & Application Engineering at Samsung Electronics. “Samsung is taking the lead in the growth of the memory market for sophisticated automotive applications, while continuing to deliver leading-edge UFS solutions with higher performance, density and reliability.”
Embedded UFS solutions have been used in a variety of mobile applications since early 2015, when Samsung introduced 128GB embedded memory based on the JEDEC UFS 2.0 standard, for the first time in the industry. Since then, the high performance and proven quality of UFS has led to its wide adoption in large numbers of mobile devices from flagship smartphones initially, to also now in mid-market smartphones.
Configured on the most up-to-date UFS standard (JEDEC UFS 2.1), the new Samsung eUFSwill provide advanced data transfer speeds and robust data reliability. For example, the new Samsung 128GB eUFS can read data at up to 850 megabytes per second (MB/s), which is approximately 3.4 times faster than the 250MB/s read speed of today’s eMMC 5.0 solutions. It also offers about 6.3 times faster random reading than eMMC at 45,000 IOPS. This will contribute to significantly enhanced performance in upcoming automotive infotainment systems for better managi ng audio content, increasing navigation responsiveness, accessing Internet-enabled traffic and weather reports, improving handling of hands-free voice commands, and speeding up rear-seat social media interplay.
The new eUFS solution also features an efficient and reliable error-handling process, which is essential for next-generation in-vehicle infotainment. Based on the MIPI UniPro®* protocol, the eUFS enables detecting and recovering from I/O error on hardware layers, without having to involve the host software or restarting tasks.
In addition, the Samsung eUFS supports advanced data refresh and temperature notification features for superior system reliability. The advanced data refresh operation allows a choice of refresh methods, and provides information on the refresh unit, frequency and progress for the host device’s control. This enables optimal data reliability, an essential element of automotive applications.
When it comes to thermal management, the Samsung eUFS equips the temperature sensor inside the controller to enable highly reliable device temperature control. This prevents the eUFS from crossing well-defined upper and lower temperature boundaries, thereby allowing its NAND cells to flawlessly function within a tough automotive temperature environment.
In light of the eUFS’ high performance and reliability, Samsung expects rapid adoption in the automotive market. Samsung will continue to satisfy the growing storage needs of leading automotive manufacturers by offering a variety of advanced eUFS lineups, while more thoroughly addressing the ever-increasing demand for leading-edge memory solutions in other market segments, too.

* Editor’s Note: MIPI UniPro® is a general purpose, unified protocol that services a wide range of interface needs in mobile and connected devices. The interface was developed by the MIPI Alliance UniPro Working Group and has been available since 2007. Its current version, v1.61, was released in 2015. For more information, please visit https://mipi.org