Samsung раскрыл некоторые планы по внедрению новых типов памяти в мобильные устройства с поддержкой 5G

На специальном мероприятии Qualcomm 4G/5G Summit, которое проходит в Гонконге, представители южнокорейского техногиганта Samsung рассказали, что в 2019-м году корпорация выпустит новую флэш-память стандарта UFS 3.0, весьма актуальную для мобильных устройств с поддержкой ультраскоростной связи пятого поколения (5G).
Такие модули памяти будут доступны производителям девайсов в вариантах с объёмом 128, 256 и 512Гб. По сравнению с предыдущей версией стандарта UFS, новая (3.0) характеризуется вдвое большей (11,6 Гбит/с) скоростью передачи данных в расчёте на линию.
Также Samsung раскрыл примерные сроки внедрения нвого типа оперативной памяти LPDDR5. Такая ОЗУ появится в смартфонах в 2020 году. Новая память обеспечит пропускную способность до 51,2 Гб/с, а её энергопотребление будет снижено на 20%.
Также производители памяти обещают появление 1-требайтных модулей в смартфонах к 2021 году.   

Samsung will debut UFS 3.0 storage in 2019; LPDDR5 launching in 2020

At Qualcomm's 4G/5G Summit in Hong Kong, Samsung's head of mobile memory product planning Jay Oh revealed that the next wave of Unified File Storage (UFS) products will launch in the first half of 2019.
UFS 3.0 will be available in 128GB, 256GB, and 512GB storage variants, and if you're looking for even more storage, Micron has stated that the first wave of phones with 1TB of internal storage will make their debut in 2021. The Smartisan R1 comes with a total storage of 1TB, but it's likely that particular device is using two 512GB storage modules. The first integrated 1TB module will be unveiled in 2021.
Advances in 3D NAND manufacturing are allowing memory makers to increase storage density while retaining the same footprint. UFS 3.0 is set to come with a dramatic increase in performance, with Samsung touting a 2x increase in memory bandwidth. UFS 2.1 is currently the go-to standard for flash storage in the mobile space, so it'll be interesting to see what UFS 3.0 has to offer.
Alongside storage solutions, Samsung and Micron are also set to roll out LPDDR5 in 2020. Samsung says it will commence mass production in 2020, with LPDDR5 delivering much higher bandwidth — ranging from 44GB/s to 51.2GB/s — while reducing power consumption by 20%.
With 5G set to go mainstream next year, a faster storage standard is needed to facilitate the new slate of experiences that will go live, and UFS 3.0 is set to be on the forefront of that change. Qualcomm is working with a series of partners to bring 5G-enabled devices to market, and Samsung is turning to its Exynos business for an in-house 5G modem.

Samsung приступил к массовому производству чипов памяти eUFC 2.1 для автомобилей

В сегодняшнем официальном пресс-релизе корпорация Samsung Electronics сообщила о запуске в серию встраиваемых модулей флэш-памяти объёмом 256Гб, предназначенных для автомобильной индустрии. модули соответствуют требованиям спецификации eUFS (embedded Universal Flash Storage) 2.1.
Южнокорейский вендор отмечает, что этот продукт стал первым в отрасли, обеспечивающем возможности, стандартизованные в UFS 3.0.
С учётом области применения модули рассчитаны на работу в диапазоне температур от -40°С до +105°С. Наличие встроенного датчика температуры позволяет уведомлять процессор о превышении допустимого предела. Эти данные процессор может использовать для снижения тактовой частоты с целью понижения температуры до приемлемого уровня.
Скорость последовательного чтения достигает 850МБ/с, а максимальная производительность на операциях чтения с произвольным доступом заявлена равной 45.000 IOPS.

Samsung Begins Mass Production of 256GB Embedded Universal Flash Storage for Automotive Applications

The new 256GB eUFS 2.1 for automotives is the industry’s first storage device to incorporate advanced features of the UFS 3.0 standard for automotive applications. 
Enhanced warranty for extended temperature range offers optimum solution for next-generation automotive systems.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.
Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.
As thermal management is crucial for automotive memory applications, Samsung’s 256GB eUFS extends the temperature range to between -40°C and +105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to +85°C for vehicles in operation and -40°C to +85°C when in idle or power-saving mode,
“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well suited for extreme environments and know they will be getting highly reliable performance,” said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”
Samsung’s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105°C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.
Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.
The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.
Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.